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Fab HTPLA
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FibReel’s fab HTPLA offers the simplicity of PLA printing with quality, compatibility, durability, performance and a finish that is so exceptional, you'll want to use it every day. The fab HTPLA is heat-treatable unlike standard PLA, but capable of much higher temperature stability than regular PLA, and it also offers exceptional finish and performance for your functional prototypes and final part production.
Semi crystalline, heat treatable PLA for high temp use
| Density; | 1.24 g/cc |
| Length: | 346 m/kg (1.75) 130 m/kg (2.85) |
| Typical Printing Temp: | 205-225 C |
| Glass Transition (Tg)*: | 60 C |
| Peak Crystallization (Tc)**: | 95-115 C |
| Onset to Melt (Tm)***: | 155 C |
| Typical change when heat treated: | -2% x/y +1% z |
| Adviced 3d print speed< | 40-50 mm/s |
| Advised Heated bed | 50-60C |
| Cooling fan | Use the least amount of cooling for best layer-to-layer adhesion. For better overhang performance use 50-100% cooling |
1. Nozzle size = 0.4 mm (Standard to most printers & balances detail with productivity.)
2. Extrusion width = 0.45 mm (Typically larger than nozzle size. If using a larger nozzle diameter, be sure to set the extrusion width larger than that nozzle diameter.)
3. Layer thickness = 0.15 mm (For a balance of speed, quality & reliability.)
4. Speed(s) = 15-45 mm/s (Respecting mechanical and volume flow limits. Stay within the recommended speed range but apply slower speeds to the walls and faster speeds to the infill.)
5. Volume flow rate(s) = 1-3 cu mm/s (The result of above speed range, width, and layer thickness. Respect hardware and geometry limitations.)
6. Typical temperature = 215 C +/- 10 C (Matching material, hardware, and volume flow rate.)
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2. Extrusion width = 0.45 mm (Typically larger than nozzle size. If using a larger nozzle diameter, be sure to set the extrusion width larger than that nozzle diameter.)
3. Layer thickness = 0.15 mm (For a balance of speed, quality & reliability.)
4. Speed(s) = 15-45 mm/s (Respecting mechanical and volume flow limits. Stay within the recommended speed range but apply slower speeds to the walls and faster speeds to the infill.)
5. Volume flow rate(s) = 1-3 cu mm/s (The result of above speed range, width, and layer thickness. Respect hardware and geometry limitations.)
6. Typical temperature = 215 C +/- 10 C (Matching material, hardware, and volume flow rate.)
1. Nozzle size = 0.4 mm (Standard to most printers & balances detail with productivity.)
2. Extrusion width = 0.45 mm (Typically larger than nozzle size. If using a larger nozzle diameter, be sure to set the extrusion width larger than that nozzle diameter.)
3. Layer thickness = 0.15 mm (For a balance of speed, quality & reliability.)
4. Speed(s) = 15-45 mm/s (Respecting mechanical and volume flow limits. Stay within the recommended speed range but apply slower speeds to the walls and faster speeds to the infill.)
5. Volume flow rate(s) = 1-3 cu mm/s (The result of above speed range, width, and layer thickness. Respect hardware and geometry limitations.)
6. Typical temperature = 215 C +/- 10 C (Matching material, hardware, and volume flow rate.)
2. Extrusion width = 0.45 mm (Typically larger than nozzle size. If using a larger nozzle diameter, be sure to set the extrusion width larger than that nozzle diameter.)
3. Layer thickness = 0.15 mm (For a balance of speed, quality & reliability.)
4. Speed(s) = 15-45 mm/s (Respecting mechanical and volume flow limits. Stay within the recommended speed range but apply slower speeds to the walls and faster speeds to the infill.)
5. Volume flow rate(s) = 1-3 cu mm/s (The result of above speed range, width, and layer thickness. Respect hardware and geometry limitations.)
6. Typical temperature = 215 C +/- 10 C (Matching material, hardware, and volume flow rate.)
1. FibReel fab HTPLA is used in a variety of outdoor, functional prints with engineering-grade performance applications as it's stronger & more durable!
2. Best suited for consumer electronics applications.
3. Accessories and hardware.
4. Simulation of old knobs and buttons.
2. Best suited for consumer electronics applications.
3. Accessories and hardware.
4. Simulation of old knobs and buttons.
